Fine-Blend Polymer (Shanghai) Co., Ltd., as a dedicated player in the field of plastic modification, will participate in the upcoming SWOP 2025 World of Packaging (Shanghai) Expo to be held at the Shanghai New International Expo Center. The expo is scheduled to take place from November 25 to 27, 2025. As a member of the interpack Alliance, a global professional packaging exhibition, it is expected to attract numerous exhibitors and professional visitors, with an exhibition area of 70,000 square meters.   
 
      At this expo, Fine-Blend will showcase its Add-Bond® series of products, which are high-performance adhesion promoters and adhesion resin products. These products are widely used in various fields, including home building materials bonding, composite pipe bonding, multi-layer barrier packaging, and new energy. Our products not only meet the needs of various composite materials and products but also contribute to the sustainable development of the packaging industry.   
      The SWOP 2025 will feature five major themed pavilions, including SAVE FOOD China, the Fast-Moving Consumer Goods Pavilion, the Smart Packaging Zone, the Printing and Labeling Pavilion, and the Packaging Materials/Containers Production and Flexible Packaging Zone. These themed pavilions will systematically display from different perspectives, covering processing and packaging machinery, packaging materials and container production, printing and labeling, and packaging design, ultimately realizing the future of the packaging industry moving towards efficiency, greenness, and intelligence.